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PCB setup

Base material

Choose the board family that supplies the mechanical and electrical foundation for the design.

Start with the plain-language explanation, then use the engineering notes, option table and references when the detail matters.

Technical overview of base material

The short answer

What this setting controls

FR-4 is the familiar rigid glass-reinforced laminate used for many digital, analogue and control boards. Flex, aluminium-core, copper-core, RF laminates and HDI materials exist for different mechanical, thermal or signal needs.

Treat material selection as a stack-up decision, not a colour choice. Compare dielectric constant, loss tangent, glass transition temperature, coefficient of thermal expansion, thermal conductivity, bend radius and the availability of a compatible stack-up.

Engineering detail for base material
Use the visual as a planning aid; the submitted design files and released drawings remain the build definition.

Options in the order form

How the available choices differ

ChoiceUse it forEngineering note
FR-4General rigid boardsBalanced mechanical, electrical and thermal performance; confirm Tg and stack-up for demanding builds.
Flex circuitBending, folding or very low massRequires bend-radius, copper type, coverlay and stiffener decisions.
Aluminium / copper coreHeat-spreading LED and power designsExcellent thermal path but different drilling, isolation and layer constraints.
Rogers / PTFE laminateRF, microwave and low-loss pathsChoose from the signal-loss model and approved stack-up, not from the material name alone.
HDIMicrovias and very dense interconnectNeeds an HDI structure, controlled lamination sequence and stack-up review.

Compatibility

What can change with this selection

  • Changing material can change the available layer, thickness, colour, finish and assembly options.
  • A material name alone is not a stack-up approval; the final build remains subject to technical review.
  • Recheck layers, thickness, laminate grade, finish, colour and assembly support after changing the material family.

Practical recommendation

How to make the decision

  1. Use FR-4 for a general rigid board unless the design has a documented thermal, RF, flex or density requirement.
  2. Use flex only when the bend path and bend radius are part of the mechanical design.
  3. Ask for an engineering review when a mixed-material or controlled-impedance stack-up is required.

Before release

Check these points before adding the quote to cart

  • Confirm the selected value matches the released Gerber, drawing, stack-up, BOM or assembly plan.
  • Review any fields that changed automatically after this selection.
  • Check the board preview and server-calculated estimate before adding the quote to cart.
  • Use FR-4 for a general rigid board unless the design has a documented thermal, RF, flex or density requirement.
  • Use flex only when the bend path and bend radius are part of the mechanical design.
  • Ask for an engineering review when a mixed-material or controlled-impedance stack-up is required.

Frequently asked questions

Answers for ordering and design review

Is FR-4 a safe default?

For many rigid prototype and production boards, yes. Keep the default when your schematic, thermal design and signal budget do not call for a specialised laminate.

When should I ask for help?

Ask when the board bends, carries substantial heat, uses fast RF links, needs a controlled impedance, or combines different laminate families.

How do I compare RF laminates?

Use the design-value dielectric constant and dissipation factor at the operating frequency, then confirm the actual stack-up, copper roughness and fabrication model used for impedance.

Why is an option disabled?

The current material, geometry, layer count, quantity or another selected process makes that combination unavailable. Change the controlling selection or revise the design package rather than trying to bypass the disabled state.

Can I rely on the online choice as final manufacturing approval?

No. The interface screens known combinations and requests pricing, while final manufacturability remains subject to the released files and technical review.

What should I record outside the order form?

Put controlled requirements in the fabrication drawing, assembly drawing, stack-up, BOM or acceptance plan. Use Special instructions only for a concise pointer to that controlled requirement.

Will changing this update other selections?

It can. The order form re-evaluates compatibility and may replace a now-invalid dependent choice before requesting a fresh server-side estimate. Review every highlighted or automatically changed field.

What if the design requires an option that is not offered?

Do not approximate it with a different label. Recheck the controlling material and geometry, document the actual requirement, and request technical review before placing the order.

Further reading

Standards and technical references

Use the latest applicable revision and your organisation’s controlled requirements when a standard forms part of product acceptance.

Ready to configure?

Apply this decision to your board.

Upload the design package, review the analysed PCB and choose only the options supported by the released design.

Open PCB ordering
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