The short answer
What this setting controls
HASL is a common general-purpose finish. Lead-free HASL supports lead-free manufacturing. OSP is a thin organic coating, while ENIG uses nickel and gold for a flat, durable pad surface.
Choose with pad geometry, storage, reflow count, contact wear, wire bonding, RF behaviour, flatness and corrosion expectations in mind. Confirm whether lead-bearing material is acceptable for the product and market.
Options in the order form
How the available choices differ
| Choice | Use it for | Engineering note |
|---|---|---|
| HASL with lead | General solderability where lead is permitted | Uneven coating can be unsuitable for very fine-pitch land patterns. |
| Lead-free HASL | General lead-free assembly | Good solderability; verify flatness for dense fine-pitch parts. |
| OSP | Flat copper pads with controlled storage and assembly | Thin organic protection; handling and storage discipline matter. |
| ENIG | Flat pads, BGAs, edge contacts and longer storage | Nickel/gold stack offers flatness and durability; process control remains important. |
Compatibility
What can change with this selection
- Some finishes are removed or disabled for specific materials, thicknesses or special processes.
- The default shown by the page is a starting choice; review the product and compliance needs.
- Finish interacts with pad flatness, edge contacts, castellations, press-fit holes and product substance requirements.
Practical recommendation
How to make the decision
- Use Lead-free HASL for a familiar general-purpose lead-free path.
- Use OSP when a thin, economical finish suits a controlled soldering and storage process.
- Use ENIG for flat fine-pitch pads, edge contacts or longer storage when its cost is justified.
Before release
Check these points before adding the quote to cart
- Confirm the selected value matches the released Gerber, drawing, stack-up, BOM or assembly plan.
- Review any fields that changed automatically after this selection.
- Check the board preview and server-calculated estimate before adding the quote to cart.
- Use Lead-free HASL for a familiar general-purpose lead-free path.
- Use OSP when a thin, economical finish suits a controlled soldering and storage process.
- Use ENIG for flat fine-pitch pads, edge contacts or longer storage when its cost is justified.
Frequently asked questions
Answers for ordering and design review
Which finish is best for fine-pitch parts?
A flat finish such as ENIG is often considered when pad coplanarity matters, but the right answer depends on the full assembly and reliability requirement.
Does lead-free HASL mean the board contains no lead anywhere?
It describes the surface-finish process. The complete product and component supply chain still need their own compliance review.
Which finish is best for fine-pitch BGAs?
A flat finish such as ENIG or a properly controlled OSP process is usually easier to print and place than an uneven hot-air-levelled surface; confirm storage and assembly constraints.
Why is an option disabled?
The current material, geometry, layer count, quantity or another selected process makes that combination unavailable. Change the controlling selection or revise the design package rather than trying to bypass the disabled state.
Can I rely on the online choice as final manufacturing approval?
No. The interface screens known combinations and requests pricing, while final manufacturability remains subject to the released files and technical review.
What should I record outside the order form?
Put controlled requirements in the fabrication drawing, assembly drawing, stack-up, BOM or acceptance plan. Use Special instructions only for a concise pointer to that controlled requirement.
Will changing this update other selections?
It can. The order form re-evaluates compatibility and may replace a now-invalid dependent choice before requesting a fresh server-side estimate. Review every highlighted or automatically changed field.
What if the design requires an option that is not offered?
Do not approximate it with a different label. Recheck the controlling material and geometry, document the actual requirement, and request technical review before placing the order.
Further reading
Standards and technical references
Use the latest applicable revision and your organisation’s controlled requirements when a standard forms part of product acceptance.
- IPC design standards overviewIPC — Rigid, flex, HDI, RF and current-carrying design-standard families.
- TI high-speed layout guidelinesTexas Instruments — Return paths, layer transitions, vias and transmission-line effects.
- PCB surface-finish corrosion studyIPC technical paper — How finish choice relates to environmental protection and corrosion.