PCB Via Plating Method

The short answer

What this setting controls

For many boards, Any is the practical choice. The process team will use a compatible standard method. More specialised choices are for designs with a known via construction or bonding need.

Tie the method to the stack-up, via geometry, filling chemistry, current density, reliability testing and supplier capability. A process-specific selection should be backed by a fabrication note or qualification basis.

Options in the order form

How the available choices differ

Choice	Use it for	Engineering note
Any	No design-mandated method	Allows the approved process to select the compatible route.
Conductive adhesive	Supported heavy-copper or filled-via constructions	Confirm electrical, thermal and reliability expectations.
Horizontal electroless copper plating	A specified plating route	Select only when the released process documentation requires it.

Compatibility

What can change with this selection

Special plating can enable heavier copper or different via structures while disabling other choices.
The selected combination must pass the manufacturing compatibility check before it can be quoted.
If the page disables a choice, treat it as a compatibility result and adjust the controlling design decision rather than forcing the value.

Practical recommendation

How to make the decision

Use Any unless a validated design rule names a specific plating approach.
Use conductive adhesive or electroless copper only when the design and process engineer require it.
Review copper weight, minimum hole and via covering together.

Before release

Check these points before adding the quote to cart

Confirm the selected value matches the released Gerber, drawing, stack-up, BOM or assembly plan.
Review any fields that changed automatically after this selection.
Check the board preview and latest estimate before adding the quote to cart.
Use Any unless a validated design rule names a specific plating approach.
Use conductive adhesive or electroless copper only when the design and process engineer require it.
Review copper weight, minimum hole and via covering together.

Frequently asked questions

Answers for ordering and design review

What does Any mean?

It means “choose a compatible process for this specification set”; it does not mean the design is exempt from minimum hole and reliability rules.

When should I change Via plating method?

Change it when the released electrical, mechanical, thermal, assembly or quality plan gives a measurable reason. Otherwise keep the compatible default and review the resulting board preview and estimate.

Why is an option disabled?

The current material, geometry, layer count, quantity or another selected process makes that combination unavailable. Change the controlling selection or revise the design package rather than trying to bypass the disabled state.

Can I rely on the online choice as final manufacturing approval?

No. The interface screens known combinations and requests pricing, while final manufacturability remains subject to the released files and technical review.

What should I record outside the order form?

Put controlled requirements in the fabrication drawing, assembly drawing, stack-up, BOM or acceptance plan. Use Special instructions only for a concise pointer to that controlled requirement.

Will changing this update other selections?

It can. The order form re-evaluates compatibility and may replace a now-invalid dependent choice before updating the quote. Review every highlighted or automatically changed field.

What if the design requires an option that is not offered?

Do not approximate it with a different label. Recheck the controlling material and geometry, document the actual requirement, and request technical review before placing the order.

Useful engineering tools

Calculators and preparation guides

Standards and technical references

Use the latest applicable revision and your organisation’s controlled requirements when a standard forms part of product acceptance.